Semiconductor
6 inch Vertical
6 inch Vertical Furnace
General Spec
- Wafer Size 150mm
- Production Wafer 150
- Process Application PYRO, LP -CVD, ANNEAL
- System Dimension 950(W)×3600(L)×2730(H)
- Wafer Loading Full Automation
- Wafer Mapping Sensor Installed
- Heater Control Zone 5 Zone
- Temp Flat Zone 750mm
- Main Control PLC + PC control
- Boat Rotation Installed
- MES, FDC control Yes
Hardware Performance
- Temp accuracy Set/Actual : ≤0.5°C
- Gas flow control Set/Actual : ≤1.0°C
- Wafer breakage 0.01%
- Safety Safety interlock, Mapping Sensor, leak detector
Process Performance
- Particle < 20ea (0.16um)
- Thickness Uniformity Oxidation : ≤±1.0% / LP-CVD : ≤±2.0%
Customer
- Partner TGMC